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Alan Patterson

Senior Correspondent at EE Times

Alan Patterson is a Senior Correspondent at EE Times, specializing in electronics journalism with a focus on the Asian technology sector. He reports on key developments in electronics manufacturing, semiconductors, and related industries across Asia, drawing from his extensive on-the-ground experience though specific company coverage and quantitative performance metrics such as success rates or investment returns are not publicly detailed in available profiles. Patterson has built his career primarily as an electronics journalist in Asia, working previously as a reporter and editor for Bloomberg News before contributing to EE Times; no specific start dates or additional prior firms are documented. His professional credentials center on journalistic expertise rather than financial licenses like FINRA registrations.

Alan Patterson's questions to ASE Technology (ASX) leadership

Question · Q4 2025

Alan Patterson asked for clarification on ASE's acquisition of clean room space from partners, specifically whether this is a new development for ASE in advanced packaging like 2.5D and 3D, given TSMC's prominence in this area. He also inquired if photonics is a new area for ASE and which specific flavors of photonics the company sees with greater potential.

Answer

Dr. Tien Wu, COO, clarified that ASE is acquiring factories with clean rooms from 'partners' (not exclusively foundries) and confirmed that 2.5D/3D advanced packaging is not new for the company. Regarding photonics, Dr. Wu described it as a new technology representing a paradigm shift, and ASE's role is to develop comprehensive toolboxes for designers across various segments (high-end, mid-range, low-end) and configurations (chip-to-chip, chip-to-package, package-to-package) without taking sides on specific alternatives.

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Question · Q4 2025

Alan Patterson asked for clarification on ASE's acquisition of clean room space from partners and whether the company's move into 2.5D/3D advanced packaging is a new development. He also inquired if photonics is a new area for ASE and which specific flavors of photonics hold greater potential for the company.

Answer

Tien Wu clarified that ASE is acquiring factories with clean rooms from 'partners' (not exclusively foundries) and confirmed that 2.5D/3D full process packaging is not new for ASE, having been performed for 'quite some time.' Regarding photonics, Dr. Wu described it as a new technology representing a paradigm shift. He stated that ASE will develop toolboxes for various alternatives (high-end, mid-range, low-end; scaled-up, scaled-out; chip-to-chip, chip-to-package, package-to-package) without favoring one, ensuring continuous electronic and optical signal handling across different segments.

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