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COO Tien Wu explained that the independent operation of ASE and SPIL allows them to serve different customer focus groups, which is an advantage. He sees future synergy opportunities with USI in areas like power management and optical solutions for AI. CFO Joseph Tung projected that depreciation at the ATM level would grow about 14% this year to approximately NT$69 billion. He also noted that the net debt to equity ratio is expected to peak in Q3 below 70% before declining back toward the 60-65% target range.

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Joseph Tung, CFO, stated that price adjustments are not a solution for tariffs and noted that the company's direct exposure to the U.S. is minimal. He explained that the small portion of EMS shipments going to the U.S. can be managed by shifting production. On general demand, Tung observed a gradual recovery in most sectors, with automotive showing strong momentum on the high-end while legacy auto components are still undergoing inventory correction.

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COO Dr. Tien Wu attributed the higher revenue forecast not to a surprising change in demand, but to ASE's increased confidence in its own execution capabilities for the complex ramp-up. He confirmed the investments are designed to be fungible for future applications like edge AI. Dr. Wu declined to comment on the profitability of specific applications, stating that ASE works with all the limited number of customers in the high-end space and cannot disclose such details.

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COO Tien Wu explained that the stronger forecast was not due to a change in demand, but rather ASE's increased confidence in its own execution capabilities. He noted they work with all key customers in the space and could not detail priorities by application, as it would reveal sensitive customer information. He also clarified the revenue target is for the most cutting-edge technologies.

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COO Tien Wu explained that the ISE lab in California is focused on innovation and R&D support, and the company will consider applying for CHIPS Act funding. However, he clarified that there is no tangible plan for high-volume manufacturing in the U.S. at this time, as customer volume requests are still under investigation. He also highlighted the company's new facility in Mexico as a resource for the North American market.

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President Jason Wang explained that while UMC does not provide long-term guidance, its strategy is to maintain ASP resilience through technology differentiation in its 22/28nm and specialty nodes. He confirmed the Intel 12nm partnership is on track, with the first PDK expected in June 2026 and customer production beginning in 2027.

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CFO Chi-Tung Liu noted an increasing appreciation from customers for UMC's geographically diverse manufacturing base, though it's difficult to quantify the impact yet. IR Manager David Wong provided an end-market update, stating that for Q2, Computing, Communications, and Consumer segments are expected to grow. However, the Automotive segment is projected to remain flattish due to persistently high inventory levels.

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President Jason Wang explained that interposer and wafer-to-wafer hybrid bonding are different offerings, and the capacity is not fungible. He noted that while RF-SOI stacking is production-ready, broader edge AI opportunities will take time to materialize. While optimistic about a long-term utilization recovery driven by AI, he stated it's too early for a specific timeline due to macro uncertainties. On pricing, he reiterated the strategy is to remain competitive by providing value through technology and partnerships, which supports ASP resilience.

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President Jason Wang confirmed that silicon interposer capacity will be maintained at 6k wafers per month with a stable run rate for 2024. He noted that other solutions, such as wafer-to-wafer hybrid bonding for RF-SOI, will be ready for production in 2024. Mr. Wang projected that 40nm and 65nm utilization would remain flattish in the second half of the year. He clarified that the company's FinFET focus is shifting to its 12-nanometer partnership in the U.S., rather than expanding the 14-nanometer node.

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Chairman & CEO Dr. C.C. Wei commented that it is 'too early' to gauge the impact of humanoid robots but acknowledged their immense long-term potential, citing their complexity and high sensor requirements. He gave a definitive 'no' to the question of demand pull-ins, stating that with long lead times and extremely tight capacity on advanced nodes, there is no room for such actions.

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CEO C.C. Wei stated that TSMC welcomes the trend of accelerated product launches, as the company was prepared for it well in advance through early customer discussions. Regarding packaging, Wei acknowledged that TSMC is looking at panel-level fan-out technology but believes it is not yet mature, estimating it will be at least three years before a solid solution is available. He confirmed TSMC is working on it and will be ready.

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Joseph Tung, CFO, stated that adjusting prices is not a solution for tariffs and noted the company's direct exposure to the U.S. is minimal and manageable by shifting production. He believes any impact would affect competitors more significantly. On demand, Mr. Tung sees a gradual recovery in most sectors, with legacy auto/MCUs still in correction but high-end auto showing good momentum. He expects the company's overall automotive business to grow this year.

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