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Dave Duley

Research Analyst at Steelhead Securities

Dave Duley is Managing Director and Senior Equity Analyst at Steelhead Securities LLC, specializing in fundamental research with a particular focus on advanced technology and industrial sectors. He covers companies including Veeco Instruments, providing in-depth analysis and recommendations known for their rigor and actionable insights; however, specific performance metrics such as success rates or ranking details are not publicly available. Duley began his investment research career in the early 2000s, previously serving as Managing Director at Merriman Capital before joining Steelhead Securities in 2009. He holds an MBA from Northeastern University, is professionally registered as a securities principal, and maintains credentials typical for a senior analyst, although specific Series licenses and FINRA numbers are not detailed in available sources.

Dave Duley's questions to KULICKE & SOFFA INDUSTRIES (KLIC) leadership

Question · Q4 2025

Dave Duley asked for clarification on Kulicke and Soffa's increasing market share in DRAM, specifically if it relates to the HBM thermal compression bonding tool shipment, and what competition they face for HBM qualification. He also inquired about the vertical wire ramp in late calendar 2026, its drivers, and fiscal 2026 expectations, along with unit growth predictions for the general semi market.

Answer

Lester Wong, Interim CEO and CFO, clarified that the market share commentary referred to DRAM generally, not specifically HBM, and confirmed the HBM discussion centered on the thermal compression bonding tool shipment for qualification. He noted competition primarily from other thermal compression bonders, not hybrids. For vertical wire, high-volume production is expected in late calendar 2026, with tool shipments in late fiscal 2026, projecting around $10 million in FY2026 and significant ramp in 2027 and beyond. Lester Wong estimated general semi unit growth at 5-7%, emphasizing confidence from high utilization rates (over 80% overall, nearly 90% in China).

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Question · Q4 2025

Dave Duley asked for clarification on Kulicke & Soffa's commentary regarding increasing market share in the HBM market, specifically if it solely refers to the HBM thermal compression bonding tool shipment. He also inquired about the competitive landscape for this HBM tool, the expected ramp for vertical wire in 2026, and the projected unit volume growth for the core general semiconductor business in 2025/2026.

Answer

Lester Wong, Interim CEO and CFO, clarified that the slide referred to increasing market share in DRAM, not specifically HBM, and confirmed the HBM commentary relates to the first HBM machine shipment for qualification. He expects competition primarily from other TCBs, not hybrid tools, for HBM. For vertical wire, Mr. Wong anticipates high-volume production in late calendar 2026, with tool shipments in late fiscal 2026, projecting around $10 million in fiscal 2026 and significant ramp in 2027. He estimated 5-7% unit growth for the core business, driven by over 80% utilization rates.

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