Question · Q4 2025
Dave Duley asked for clarification on Kulicke and Soffa's increasing market share in DRAM, specifically if it relates to the HBM thermal compression bonding tool shipment, and what competition they face for HBM qualification. He also inquired about the vertical wire ramp in late calendar 2026, its drivers, and fiscal 2026 expectations, along with unit growth predictions for the general semi market.
Answer
Lester Wong, Interim CEO and CFO, clarified that the market share commentary referred to DRAM generally, not specifically HBM, and confirmed the HBM discussion centered on the thermal compression bonding tool shipment for qualification. He noted competition primarily from other thermal compression bonders, not hybrids. For vertical wire, high-volume production is expected in late calendar 2026, with tool shipments in late fiscal 2026, projecting around $10 million in FY2026 and significant ramp in 2027 and beyond. Lester Wong estimated general semi unit growth at 5-7%, emphasizing confidence from high utilization rates (over 80% overall, nearly 90% in China).
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