Question · Q4 2025
Didier Scemama from Bank of America asked about the implications of 4F² DRAM on EUV layer count, specifically addressing the market's concern about a potential "cliff" in EUV demand from DRAM customers around 2028 due to tool reuse. He questioned if this risk is diminishing given the need for more advanced litho and expanding wafer capacity driven by AGI. He also inquired about the gross margin outlook for 2026, considering the mix of Low-NA EUV, potential decline in immersion due to China, and the impact of upgrades, and whether the 2027 EUV mix would revert to a majority of 3800E.
Answer
CFO Roger Dassen explained that 4F² structures require more advanced lithography, increasing both immersion and EUV layers. CEO Christophe Fouquet added that customers dislike "cliffs" and optimize technology over several nodes, finding EUV beneficial for simplifying processes, reducing cycle time, and increasing capacity. He expressed confidence that litho intensity will grow with 4F² for both DUV and EUV. Roger Dassen detailed gross margin factors for 2026: headwinds include more 3600s in EUV mix, immersion sales below 2025 (due to supply constraints, not demand), more dry sales (lower GM), and High NA's initial depressing effect. Tailwinds include higher EUV unit numbers, with installed base upgrades being a significant swing factor. He confirmed the 2027 EUV mix should be substantially better, with more 3800E and next-generation tools.
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