Question · Q4 2025
Harlan Sur sought clarification on the $73 billion AI backlog for the next six quarters, asking if it's a dynamic number expected to grow, and questioned Broadcom's supply chain commitments for 3nm/2nm wafers, CoWoS, substrate, and HBM, specifically regarding the role of the Singapore facility in advanced packaging.
Answer
Hock Tan (President and CEO, Broadcom) confirmed the $73 billion backlog is a current snapshot and is expected to grow with new orders. He stated that Broadcom is addressing supply chain challenges, particularly in advanced packaging, by partially insourcing these capabilities at its Singapore facility for supply chain security and delivery. He also mentioned reliance on TSMC for silicon capacity in 2nm and 3nm, with no current constraints.
Ask follow-up questions
Fintool can predict
AVGO's earnings beat/miss a week before the call