Question · Q4 2025
Michael Mani, Equity Research Associate at Bank of America, asked about the contribution of the chiplet business to Camtek's AI-related growth last year and the company's share position with its lead chiplet customer, particularly regarding potential share gains in 2D applications and its impact on second-half strength. He also sought an update on Camtek's production capacity, questioning if the previously stated $650 million capacity is sufficient for future demand and the lead time for adding new capacity.
Answer
COO Ramy Langer stated that Camtek does not segment chiplets from HBM, referring to them as high-performance computing (50% of business). He confirmed Camtek's significant vendor status with TSMC for chiplets, participating in multiple steps, and expressed optimism about gaining market share in this area. Regarding capacity, Langer updated that internal efficiencies have increased current capacity to over $700 million, with no immediate limitations. He also mentioned plans for additional capacity in Europe, expected to be operational by late 2026.
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