Richard Neaton

Richard Neaton asked about the specific use cases and end applications for chiplets utilizing programmable logic. He also sought clarification on QuickLogic's 'bridging' technology, specifically whether it involves bridging on the chiplet itself, between multiple chiplets, or between multi-layer chiplets.

Answer

President and CEO Brian Faith outlined chiplet use cases in Aerospace & Defense for miniaturization and cost reduction, using FPGAs for sensor pre-processing and adapting existing software. He also highlighted security applications, including post-quantum computing, where reprogrammable hardware can adapt to cyber threats. Regarding bridging, Brian Faith explained that chiplets currently lack universal compatibility due to differing physical and protocol layers. QuickLogic's programmable eFPGA hardware can act as a 'translator' or bridge between incompatible protocol layers, even if physical layers connect, by programming the FPGA to add compatibility.

Richard Neaton of Rivershore Investment Research asked for more details on the storefront opportunity pipeline, the specific value proposition for the USMAG market concerning verification costs, and the potential to expand the Faraday partnership to more advanced nodes like 12nm.

Answer

CEO Brian C. Faith highlighted several storefront opportunities in the funnel, including government RFPs for a Chiplet ecosystem and interest generated from the Intel Foundry Chiplet Alliance. He detailed the USMAG value proposition, explaining that integrating FPGAs into ASICs reduces SWaP-C (Size, Weight, Area, Performance, Cost) and significantly lowers qualification and verification costs compared to using multiple discrete chips. Regarding Faraday, Faith expressed strong interest in expanding to advanced nodes like 12nm and noted Faraday's 18A-related presence at Intel Direct Connect as a positive indicator for future collaboration.