Question · Q3 2025
Steve Barger asked about the shift towards RDL formats replacing silicon interposers in compute, inquiring how much CapEx supports RDL and if this shift drives higher value-add/unit margins or primarily volume. He also questioned the gating factors for high-density fan-out adoption in higher-volume applications like PC or mobile.
Answer
CEO Giel Rutten stated that a significant majority of Amkor's CapEx is allocated to high-density fan-out (RDL-based technology), noting that capital investments are highly fungible across various packaging types. He explained that this technology will be applied across multiple domains, including data centers, PCs, and mobile, using the same production lines, with basic capacity supporting products across these segments despite individual specification differences.
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