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Nitto Denko: Semiconductor Plasma Dicing Tape Market Projected to Reach $2.15 Billion by 2032
NDEKY
Product Launch
New Projects/Investments
Revenue Acceleration/Inflection
- The Semiconductor Plasma Dicing Tape Market was valued at USD 1.15 Billion in 2024 and is projected to grow to USD 2.15 Billion by 2032, exhibiting a CAGR of 8.17% from 2025 to 2032.
- This market expansion is primarily driven by the increasing demand for high-precision wafer dicing in advanced semiconductor manufacturing, including MEMS, LEDs, and 3D ICs, coupled with technological advancements in tape materials.
- In 2024, Asia Pacific dominated the market with a 41.56% revenue share, while North America is expected to be the fastest-growing region from 2025 to 2032, with a projected CAGR of 9.01%.
- Nitto Denko Corporation is among the leading market players, having launched its NF735 series plasma dicing tape in May 2024, designed for 2.5D/3D packaging and HBM applications.
Nov 3, 2025, 12:00 PM
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