Earnings summaries and quarterly performance for Broadcom.
Executive leadership at Broadcom.
Board of directors at Broadcom.
Research analysts who have asked questions during Broadcom earnings calls.
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Recent press releases and 8-K filings for AVGO.
- Broadcom has started shipping a custom 2nm AI system-on-chip to Fujitsu, built on its 3.5D eXtreme Dimension System in Package to enable dense vertical die stacking for large-scale AI workloads.
- Fujitsu’s Monaka design features a 144-core configuration with four 2nm compute dies (36 Armv9 cores each), integrated 5nm SRAM chiplets, and a central I/O die providing DDR5 and PCIe 6.0 connectivity.
- The 3.5D-XDSiP uses face-to-face hybrid bonding to increase die-to-die bandwidth, reduce signal travel, and improve power efficiency and latency versus prior 2.5D approaches.
- Developed over roughly five years in collaboration with TSMC, Broadcom plans broader customer access and additional shipments in 2026, positioning it as a competitor in AI infrastructure.
- Broadcom introduced the BroadPeak™ BCM85021, the industry’s first integrated radio DFE SoC for 5G Advanced and 6G, delivering up to 40% power reduction with a 5 nm CMOS DFE and ADC/DAC design.
- The device integrates digital predistortion, carrier aggregation, and RF front-end functions, supporting RF carrier frequencies from 400 MHz to 8.5 GHz, iBW up to 860 MHz, oBW up to 800 MHz, and ADC/DAC sampling rates up to 19.6 GS/s.
- BroadPeak meets technical requirements for the 5G Advanced n104 band (6.425–7.125 GHz) and the 6G upper mid-band (7–8.5 GHz), enabling next-generation high-capacity, AI-driven networks.
- Samples of the BCM85021 are now shipping to early access customers; contact local Broadcom sales representatives for pricing and availability.
- 86% of surveyed enterprises are actively reducing their VMware footprint two years after Broadcom’s acquisition.
- 88% express concern over future price increases, signaling sustained cost pressure.
- In 2024, 73% expected VMware costs to more than double, but only 5% have experienced 100%+ increases to date.
- 72% of migrating workloads are moving to public cloud IaaS, with 38% to Hyper-V/Azure Stack and 34% to SaaS replacements.
- 41% report increased executive pressure on VMware strategy decisions since the acquisition.
- On Feb. 3, 2026, Broadcom unveiled an enterprise-grade Wi-Fi 8 AP platform powered by the new BCM49438 APU with Wi-Fi 8 radios, paired with the Trident X3+ BCM56390 switch supporting up to 48 multi-gigabit ports in a unified AI-ready architecture.
- The solution implements MACsec encryption across all switch ports and access points, and features a Secure Boot engine with Hardware Root-of-Trust for end-to-end security.
- It introduces advanced telemetry and analytics engines across the Wi-Fi 8 APs and campus switching infrastructure to enable real-time insights and AI-powered network operations (AIOps).
- Integrated Edge AI/ML acceleration on the AP eliminates the need for a separate NPU or coprocessor, and the complete Wi-Fi 8 AP and switch solution is currently sampling to early access customers.
- Ainekko merges with Veevx, integrating MRAM-based iRAM memory and low-power AI accelerators, and will operate under the Ainekko name.
- Douglas Smith, co-founder of Veevx and former Broadcom IP manager, joins Ainekko’s executive team to drive its open silicon roadmap.
- The combined platform will enable intelligent memory subsystems, embedded inference accelerators, and open-source RTL and tooling for developer customization.
- Ainekko will participate in FOSDEM’26, underscoring its commitment to community-led, edge-native AI hardware development.
- On January 6, 2026, Broadcom entered into an underwriting agreement to issue $4.5 billion aggregate principal amount of senior notes, comprising $750 million of 4.300% notes due 2031, $1.25 billion of 4.600% notes due 2033, $1.25 billion of 4.950% notes due 2036 and $1.25 billion of 5.700% notes due 2056.
- The notes will be unsecured, unsubordinated obligations ranking equally with all existing and future unsecured indebtedness, with no guarantees from subsidiaries.
- The offering is priced at approximately 99.33–99.90% of par, implying yields of 4.322% to 5.747% across maturities, and is expected to close on January 13, 2026 (T+5).
- Broadcom intends to use net proceeds of about $4.47 billion for general corporate purposes and debt repayment.
- Broadcom shares fell nearly 11% as the company warned that increasing AI investment would compress profit margins despite reporting record revenue and raising its dividend.
- KeyBanc lifted its price target on Broadcom to $500 from $460, citing AI revenues of $6.5 billion in Q4 and an anticipated rise to $8.2 billion in Q1, plus an $11 billion Anthropic order for late 2026.
- The broader tech sector also saw pressure, with Oracle down over 10% on cash burn and capex concerns, and Nvidia considering scaling up H200 chip production after receiving export approval for sales to China.
- President Trump signed an executive order to limit state-level AI regulations, aiming to maintain U.S. leadership in artificial intelligence.
- Record Q4 consolidated revenue of $18 billion (+28% YoY) and adjusted EBITDA of $12.12 billion (68% margin; +34% YoY)
- Q4 semiconductor revenue $11.1 billion (+35% YoY) driven by AI semis $6.5 billion (+74% YoY); Q4 infrastructure software revenue $6.9 billion (+19% YoY)
- AI order backlog of $73 billion for next 18 months and infrastructure software backlog of $73 billion, up from $49 billion a year ago
- Q1 FY2026 guidance: consolidated revenue $19.1 billion (+28% YoY), AI semiconductor revenue $8.2 billion (+100% YoY), infrastructure software revenue $6.8 billion; adjusted EBITDA ~67%
- Q1 dividend raised 10% to $0.65 per share (record annual $2.60); $7.5 billion share repurchase capacity extended through 2026
- Record Q4 revenue of $18.0 billion (+28% y/y) and adjusted EBITDA of $12.12 billion (+34% y/y); AI semiconductor revenue was $6.5 billion (+74% y/y), and infrastructure software revenue was $6.9 billion (+19% y/y)
- Fiscal 2025 full-year revenue of $63.9 billion (+24% y/y), with semiconductor revenue of $36.9 billion (+22%), software revenue of $27.0 billion (+26%), and free cash flow of $26.9 billion (+39% y/y)
- Q1 FY 2026 guidance: consolidated revenue of $19.1 billion (+28% y/y); AI semiconductor revenue to double to $8.2 billion, non-AI semiconductor revenue of $4.1 billion, infrastructure software revenue of $6.8 billion, and adjusted EBITDA of ~67%
- AI order backlog exceeds $73 billion, to be delivered over the next 18 months; infrastructure software backlog also at $73 billion, up from $49 billion a year ago
- Increased quarterly dividend to $0.65 per share (10% increase), implying an annual dividend of $2.60 (15th consecutive annual increase)
- Broadcom reported Q4 revenue of $18 billion, up 28% YoY, and adjusted EBITDA of $12.12 billion, up 34% YoY.
- Semiconductor segment revenue reached $11.1 billion (+35% YoY), driven by AI semiconductor sales of $6.5 billion (+74% YoY) and a total AI order backlog exceeding $73 billion.
- Infrastructure Software revenue was $6.9 billion, up 19% YoY, with bookings of $10.4 billion in Q4 and a year-end software backlog of $73 billion.
- For fiscal 2025, Broadcom achieved $63.9 billion in revenue (+24% YoY), $43 billion of adjusted EBITDA (67% margin), and $26.9 billion in free cash flow (+39% YoY).
- Q1 FY2026 guidance calls for $19.1 billion in revenue (+28% YoY) with AI semiconductors doubling to $8.2 billion; the quarterly dividend was raised 10% to $0.65 per share (implying $2.60 annual).
Quarterly earnings call transcripts for Broadcom.
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