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Micron Technology, Inc. is a leader in innovative memory and storage solutions, offering a portfolio of high-performance DRAM, NAND, and NOR memory and storage products through its Micron® and Crucial® brands. The company operates through four main business units, focusing on different market segments, including data centers, mobile devices, automotive, and consumer markets . Micron emphasizes technology leadership and operational excellence to maintain its competitive edge in the semiconductor memory and storage markets .
- Compute and Networking Business Unit (CNBU) - Develops memory products for data centers, PCs, graphics, and networking markets.
- Mobile Business Unit (MBU) - Provides memory solutions for the smartphone and mobile-device markets.
- Embedded Business Unit (EBU) - Targets the automotive, industrial, and consumer embedded markets with specialized memory products.
- Storage Business Unit (SBU) - Offers SSDs and storage solutions for data centers, PCs, and consumer markets.
| Name | Position | External Roles | Short Bio | |
|---|---|---|---|---|
Sanjay Mehrotra ExecutiveBoard | President, Chief Executive Officer, and Director | Board Member at CDW Corporation | Over 40 years of experience in the semiconductor memory industry; co-founded and led SanDisk Corporation as CEO until its sale in 2016. | View Report → |
April S. Arnzen Executive | Executive Vice President and Chief People Officer | None | Joined Micron in 1996; promoted to EVP in 2023; oversees global human resources strategy; holds a BS in HR Management and Marketing from the University of Idaho. | |
Manish Bhatia Executive | Executive Vice President, Global Operations | None | Joined Micron in 2017; oversees manufacturing, supply chain, and IT; previously EVP at Western Digital and SanDisk. | |
Mark J. Murphy Executive | Executive Vice President and Chief Financial Officer | Board Member at Albany International Corp. | Joined Micron in 2022; previously CFO at Qorvo, Inc. and Delphi Automotive PLC; U.S. Marine Corps veteran with an MBA from Harvard. | |
Michael Ray Executive | Senior Vice President, Chief Legal Officer, and Corporate Secretary | None | Joined Micron in 2024; previously held leadership roles at Western Digital Corporation, including Chief Legal Officer. | |
Michael W. Bokan Executive | Senior Vice President, Worldwide Sales | None | Joined Micron in 1996; named SVP in 2018; leads global sales strategy; holds a BS in Business Administration from Colorado State University. | |
Scott J. DeBoer Executive | Executive Vice President, Technology & Products | None | Joined Micron in 1995; leads technology and product development; holds a PhD in Electrical Engineering and an MS in Physics from Iowa State University. | |
Scott R. Allen Executive | Corporate Vice President and Chief Accounting Officer | None | Joined Micron in 2020; previously held executive roles at NetApp, Inc.; holds a BBA in Accounting from Siena College. | |
Sumit Sadana Executive | Executive Vice President and Chief Business Officer | Lead Independent Director at Silicon Laboratories, Inc. | Over 30 years of technology industry experience; oversees Micron's business units, strategy, and corporate development; has led $40 billion in M&A deals. | |
Linnie M. Haynesworth Board | Director | Board Member at Truist Financial, ADP, and Eastman Chemical; Member of the Defense Business Board | Joined Micron's board in 2021; extensive experience in cybersecurity and technology integration; former executive at Northrop Grumman. | |
Lynn Dugle Board | Lead Independent Director (effective January 2025) | Board Member at EOG Resources, KBR, and TE Connectivity Ltd. | Joined Micron's board in 2020; extensive experience in defense and technology industries; previously CEO of Engility Holdings and executive at Raytheon. | |
Mary Pat McCarthy Board | Director | Board Member at Palo Alto Networks, Inc. | Joined Micron's board in 2018; former Vice Chair of KPMG LLP; brings deep expertise in financial and accounting matters; Chair of Micron's Audit Committee. | |
MaryAnn Wright Board | Director | Board Member at Group 1 Automotive, Brunswick Corporation, and Solid Power | Joined Micron's board in 2019; extensive experience in automotive and energy storage industries; previously held leadership roles at Johnson Controls and Ford Motor Company. | |
Richard M. Beyer Board | Director | None | Joined Micron's board in 2013; extensive expertise in technology, corporate strategy, and financial management; former CEO of Freescale Semiconductor. | |
Robert E. Switz Board | Chair of the Board of Directors (retiring January 2025) | Board Member at Marvell Technology Group Ltd. | Joined Micron's board in 2006; Chair since 2012; instrumental in recruiting CEO Sanjay Mehrotra; retiring after the January 2025 shareholders meeting. | |
Robert Swan Board | Director | Operating Partner at Andreessen Horowitz; Board Member at Nike, Flexport, and GoTo Group | Joined Micron's board in 2024; former CEO of Intel Corporation; extensive experience in finance and leadership roles across multiple industries. | |
Steven J. Gomo Board | Director | Board Member at Nutanix, Inc. and Enphase Energy, Inc. | Joined Micron's board in 2018; former CFO of NetApp; brings expertise in finance, accounting, and technology. |
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With your OpEx increasing by 15% and a higher mix of HBM in your capacity, what is your confidence level in operating margin expansion throughout fiscal '25, and how are you managing the risks associated with higher costs?
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As you transition to 12-high HBM stacks and anticipate a higher trade ratio, how do you plan to address the potential increase in production costs and maintain competitiveness in the market?
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Given the increased supply from China in lower-end DRAM and NAND products, how does this impact your strategy to focus on higher-profit segments, and what measures are you taking to mitigate any potential disruptions?
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Can you provide more transparency on the percentage of your DRAM bit shipments that are still DDR4, and how quickly do you expect to reduce your exposure to lagging-edge products amid concerns about excess supply?
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With your reliance on yield improvements for the aggressive ramp of HBM products, what contingencies are in place if yields do not improve as expected, and how might this affect your ability to meet growing AI customer demand?
Competitors mentioned in the company's latest 10K filing.
| Company | Description |
|---|---|
Kioxia Holdings Corporation | We face intense competition in the semiconductor memory and storage markets from a number of companies, including this company. Our competitors may use aggressive pricing to obtain market share. Some of our competitors are large corporations or conglomerates that may have a larger market share and greater resources to invest in technology, capitalize on growth opportunities, and withstand downturns in the semiconductor markets in which we compete. |
Samsung Electronics Co., Ltd. | We face intense competition in the semiconductor memory and storage markets from a number of companies, including this company. Our competitors may use aggressive pricing to obtain market share. Some of our competitors are large corporations or conglomerates that may have a larger market share and greater resources to invest in technology, capitalize on growth opportunities, and withstand downturns in the semiconductor markets in which we compete. |
SK hynix Inc. | We face intense competition in the semiconductor memory and storage markets from a number of companies, including this company. Our competitors may use aggressive pricing to obtain market share. Some of our competitors are large corporations or conglomerates that may have a larger market share and greater resources to invest in technology, capitalize on growth opportunities, and withstand downturns in the semiconductor markets in which we compete. |
We face intense competition in the semiconductor memory and storage markets from a number of companies, including this company. Our competitors may use aggressive pricing to obtain market share. Some of our competitors are large corporations or conglomerates that may have a larger market share and greater resources to invest in technology, capitalize on growth opportunities, and withstand downturns in the semiconductor markets in which we compete. | |
Yangtze Memory Technologies Co., Ltd. (YMTC) | We face the threat of increasing competition as a result of significant investment in the semiconductor industry by the Chinese government and various state-owned or affiliated entities, in companies such as this company. |
ChangXin Memory Technologies, Inc. (CXMT) | We face the threat of increasing competition as a result of significant investment in the semiconductor industry by the Chinese government and various state-owned or affiliated entities, in companies such as this company. |
Recent press releases and 8-K filings for MU.
- Micron Technology, Inc. announced on April 29, 2025 the issuance of $500 million 5.65% Senior Notes due 2032 and $1.25 billion 6.05% Senior Notes due 2035 under a Form S-3 registration statement.
- The new notes feature semi-annual interest payments starting November 1, 2025, with maturities on November 1, 2032 and November 1, 2035, respectively.
- Proceeds from the offerings are targeted to redeem outstanding 2027 Notes and for general corporate purposes, with the transaction supported by a supplemental indenture and legal opinion.
- Micron highlighted a TAM increase for HBM driven by robust shipments and an accelerated shift to 12-high products, which are expected to command higher average selling prices.
- The management emphasized market share gains in HBM and its technology leadership, setting the stage for potentially higher revenues in 2026 compared to 2025.
- The company discussed supply dynamics, noting that while overall DRAM demand is high, Micron’s constrained non-HBM capacity will require disciplined investment and capacity management.
- Micron announced plans to add a second HBM manufacturing facility, scheduled to become operational in 2027, signaling significant long-term capacity investments.
- Q2 revenue reached $8.1B, with DRAM contributing $6.1B (76%) and NAND $1.9B (23%), reflecting a 38% year-over-year increase despite a sequential decline.
- The company achieved a new record in data center DRAM revenue and surpassed over $1B in quarterly HBM revenue, driven by strong shipment performance and increased HBM market share.
- For fiscal Q3, Micron provided guidance of approximately $8.8B in revenue with stable EPS expectations, while maintaining a disciplined $14B capex plan to support strategic investments.
- Key manufacturing milestones include progress on the new DRAM fab in Idaho and the HBM advanced packaging facility in Singapore, underpinning future growth initiatives.
- Total Q2 revenue reached approximately $8.1 billion, with DRAM revenue of $6.1 billion and NAND revenue of $1.9 billion, reflecting strong year-over-year growth and record data center DRAM revenue.
- High-bandwidth memory (HBM) shipments set a new milestone, growing over 50% sequentially to exceed $1 billion in quarterly revenue, positioning Micron as a leader in advanced HBM technologies.
- The company reported an operating income of $2 billion (24.9% margin) and EBITDA of $4.1 billion (50.7% margin), alongside strong operating cash flows and free cash flow of $857 million, supported by disciplined cost management.
- Looking ahead, Micron is guiding for record Q3 revenue growth with continued strength in both DRAM and NAND, driven by high-value technology advancements and strategic investments in new production facilities.
- Micron reported Q2 2025 revenue of $8.1 billion, with DRAM contributing 76% (approximately $6.1 billion) and NAND 23% of total revenue, reflecting an 8% sequential decline but a 38% year-over-year increase.
- Data center performance marked a new milestone, with record data center DRAM revenue and HBM revenue exceeding $1 billion in the quarter, demonstrating strong execution in high-margin product categories.
- The company outlined a robust outlook for upcoming quarters, highlighting volume production of HBM3E 12H, ramping capacity for HBM, and projecting Q3 revenue of about $8.8 billion, alongside planned capital expenditures of approximately $14 billion for fiscal 2025.
- Micron Technology Inc. delivered its Q2 2025 financial results, reporting revenue of $8.05 billion and GAAP net income of $1.58 billion, reflecting a period of strong execution.
- The report highlights significant growth in data center DRAM demand and record data center revenue driven by robust AI market trends.
- The company provided Q3 2025 guidance with expected revenue of approximately $8.80 billion and reaffirmed its commitment to improved profitability and operational excellence.
- For further inquiries, the designated contacts are Satya Kumar for Investor Relations and Mark Plungy for Media Relations.
- On March 12, 2025, the company entered into a $3.5 billion revolving credit facility agreement with HSBC Bank USA and other lenders, providing funds for general corporate purposes.
- The new agreement includes a $250 million documentary credit sublimit and permits an incremental increase of up to $1.5 billion under certain conditions.
- The existing $2.5 billion credit facility was terminated without incurring material early termination penalties.
- The agreement mandates maintaining a net leverage ratio not exceeding 3.25 to 1.00 (temporarily up to 3.75 to 1.00 following certain acquisitions) and outlines specific events of default.