Earnings summaries and quarterly performance for MICRON TECHNOLOGY.
Research analysts who have asked questions during MICRON TECHNOLOGY earnings calls.
Timothy Arcuri
UBS
11 questions for MU
Vivek Arya
Bank of America Corporation
10 questions for MU
Vijay Rakesh
Mizuho
9 questions for MU
Harlan Sur
JPMorgan Chase & Co.
8 questions for MU
Aaron Rakers
Wells Fargo
7 questions for MU
Krish Sankar
TD Cowen
7 questions for MU
Brian Chin
Stifel Financial Corp.
6 questions for MU
CJ Muse
Cantor Fitzgerald
6 questions for MU
Joseph Moore
Morgan Stanley
6 questions for MU
Chris Danely
Citi
5 questions for MU
Jim Schneider
Goldman Sachs
5 questions for MU
Kevin Cassidy
Rosenblatt Securities
5 questions for MU
Thomas O’Malley
Barclays Capital
5 questions for MU
Tom O'Malley
Barclays
4 questions for MU
John Vinh
KeyBanc Capital Markets
3 questions for MU
Karl Ackerman
BNP Paribas
3 questions for MU
Quinn Bolton
Needham & Company, LLC
3 questions for MU
Chris Caso
Wolfe Research LLC
2 questions for MU
Chris Daintley
Citigroup Inc.
2 questions for MU
Christopher Danely
Citigroup Inc.
2 questions for MU
Christopher Muse
Cantor Fitzgerald
2 questions for MU
C J Muse
Tanner Fitzgerald
2 questions for MU
Joe Moore
Morgan Stanley
2 questions for MU
Sreekrishnan Sankarnarayanan
Wolfe Research, LLC
2 questions for MU
Steven Fox
Fox Research
2 questions for MU
Christopher Caso
Wolfe Research
1 question for MU
Mehdi Hosseini
Susquehanna Financial Group
1 question for MU
Srinivas Pajjuri
Raymond James & Associates, Inc.
1 question for MU
Recent press releases and 8-K filings for MU.
- Completed an oversubscribed $50 million Series A₁ round, bringing total funding to $74 million to date.
- Round led by Matter Venture Partners—whose founder Wen Hsieh joins the board—with participation from TSMC’s risk-investment arm, Bessemer, Micron, MediaTek and Ericsson.
- Proceeds will accelerate development and global deployment of its Agentic AI platform, an AI-native infrastructure for end-to-end chip design workflows.
- Platform annual recurring revenue (ARR) grew 140× year-over-year, and ChipAgents has secured multi-year, multimillion-dollar contracts with 80 leading fabless semiconductor companies.
- CFO Mark Murphy said demand significantly exceeds supply, with the market remaining tight beyond 2026 due to AI-driven memory requirements.
- Announced new greenfield investments: a DRAM fab groundbreaking in New York and a NAND fab in Singapore (first wafers H2 2028), plus the $1.8 billion Tongluo site acquisition in Taiwan closing in Q2 2026.
- Micron is in high-volume production of HBM4, has commenced customer shipments, is ramping volumes in calendar Q1 2026, and has sold out its 2026 HBM supply with >11 Gbps performance.
- Financial outlook strengthened since the last earnings call, with Q2 2026 gross margin guidance of ~68% and expected margin expansion into Q3 2026.
- Progressing multi-year supply agreements with customers to secure longer-term commitments beyond traditional quarter-to-quarter LTAs, details to be announced later.
- Micron sees demand significantly exceeding supply, driven by AI workloads, and expects tight supply–demand balance beyond 2026.
- The company is ramping HBM4 in high-volume production, with customer shipments starting in calendar Q1 2026 and full-year 2026 HBM supply already sold out.
- Announced two new fab groundbreakings—a DRAM facility in New York and a NAND fab in Singapore (first wafer H2 2028)—and agreed to acquire the Tongluo Taiwan fab for $1.8 billion, closing in Q2 2026.
- Q2 2026 gross margin guidance is 68%, with expectations for further margin expansion in Q3 driven by pricing strength, cost control, and product mix.
- Customers are moving to multi-year supply agreements with firm commitments over 3–5+ years to secure critical memory and storage capacity for AI and data-center applications.
- Micron expects supply-demand tightness beyond 2026 as AI-driven demand outpaces available capacity despite inventory reductions and asset utilization efforts.
- Announced two new fab groundbreakings—DRAM in New York and NAND in Singapore (first wafer in 2H 2028)—and acquired the Tongluo DRAM site in Taiwan for $1.8 billion to bolster long-term capacity.
- Advanced HBM4 into high-volume production with customer shipments commenced and ramping in calendar Q1; 2026 HBM supply sold out.
- Financial outlook strengthened with current-quarter gross margin guided at 68%, with expected further expansion into Q3 driven by favorable pricing and mix.
- Maintaining disciplined CapEx plan of $20 billion in FY 2026 plus incremental Tongluo investment, targeting mid-2027 volume from Idaho One and late-2027/early-2028 production from Tongluo.
- HSBC raised Micron’s price target to $500 (from $350), citing a DRAM price rally and forecasting high double-digit growth in fiscal Q2 operating profit.
- Jim Cramer listed Micron among firms facing product shortages and described its CEO as “too modest”.
- $24 billion investment over the next decade to build an advanced wafer fab in Singapore’s NAND complex with ~700,000 sq ft of cleanroom, targeting wafer output in H2 2028.
- Aimed at meeting surging AI-driven demand for NAND storage and strengthening Micron’s NAND Center of Excellence, supply-chain resiliency, and industry–academia partnerships.
- Co-located with an HBM advanced packaging plant expected to start contributing supply in 2027, creating operational synergies.
- Supported by a strong balance sheet (market cap $437.9 billion; current ratio 2.46; debt-to-equity 0.21; Altman Z-Score 12.08) underpinning the long-term commitment.
- Micron commits US $24 billion over 10 years for a new advanced wafer fab at its Singapore NAND complex.
- The 700,000 sq ft double-story cleanroom will start wafer output in 2H 2028 to meet growing AI and data-centric demand.
- The project will create around 1,600 jobs, bringing total new roles to about 3,000 including the HBM packaging facility.
- Co-location of R&D and manufacturing aims to accelerate time-to-market, improve efficiencies and bolster supply chain resiliency.
- The fab will adhere to LEED standards for greenhouse gas abatement, water recycling and waste circularity.
- Micron has flipped from deep losses to a potential DRAM/NAND super-cycle, driven by surging demand for high-bandwidth memory (HBM)—which requires 3–4× the wafer capacity of standard DRAM—and has caused supply shortages and higher prices.
- The company’s revenue nearly halved in fiscal 2023 and its debt exceeded $13 billion; it derives 80% of revenue from DRAM and 20% from NAND.
- Texas is emerging as a major data-center frontier—benefiting from abundant land, deregulated power markets, and robust energy and fiber networks—likely boosting future memory demand as projects scale in West Texas.
- California is losing share as a data-center hub due to high costs, regulatory hurdles, and power delays; Northern California ranks 9th and Southern California 12th by capacity, threatening local demand despite partnership efforts.
- Exclusive letter of intent to buy Powerchip’s Tongluo P5 fab for $1.8B; expected to close by Q2 2026
- The 300mm, 300,000 sq ft facility could yield ~50,000 wafers/month, potentially boosting annual DRAM output by 10–15%
- Micron will phase in DRAM production with meaningful output in H2 2027, while Powerchip supports legacy DRAM and post-wafer assembly during the transition
- Move aligns with Micron’s U.S. investment push (New York complex groundbreaking) and spurred RBC’s Outperform rating (PT $425) amid a Strong Buy consensus (avg PT $363.77)
- Micron signs an LOI to acquire PSMC’s Tongluo P5 fab in Taiwan for US$1.8 billion, including a 300,000 sq ft 300 mm cleanroom.
- Transaction is expected to close by Q2 2026 pending final agreements and regulatory approvals.
- Upon closing, Micron will ramp up DRAM production in phases, aiming for meaningful wafer output in 2H 2027.
- Acquisition complements Micron’s Taiwan operations and supports its long-term global memory demand strategy.
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Quarterly earnings call transcripts for MICRON TECHNOLOGY.
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