Earnings summaries and quarterly performance for ADVANCED MICRO DEVICES.
Executive leadership at ADVANCED MICRO DEVICES.
Lisa Su
Detailed
Chair, President and Chief Executive Officer
CEO
AH
Ava Hahn
Detailed
Senior Vice President, General Counsel and Corporate Secretary
DG
Darren Grasby
Detailed
Executive Vice President, Chief Sales Officer
FN
Forrest Norrod
Detailed
Executive Vice President and General Manager, Data Center Solutions Business Unit
JH
Jack Huynh
Detailed
Senior Vice President and General Manager, Computing and Graphics Business Group
JH
Jean Hu
Detailed
Executive Vice President, Chief Financial Officer and Treasurer
MP
Mark Papermaster
Detailed
Executive Vice President and Chief Technology Officer
PG
Philip Guido
Detailed
Executive Vice President, Chief Commercial Officer
Board of directors at ADVANCED MICRO DEVICES.
Research analysts who have asked questions during ADVANCED MICRO DEVICES earnings calls.
Aaron Rakers
Wells Fargo
7 questions for AMD
Also covers: AAPL, ANET, AVGO +19 more
JB
Joshua Buchalter
TD Cowen
7 questions for AMD
Also covers: ADI, AIP, ALGM +15 more
Timothy Arcuri
UBS
7 questions for AMD
Also covers: ADI, ALGM, AMAT +17 more
VA
Vivek Arya
Bank of America Corporation
7 questions for AMD
Also covers: ADI, ALGM, AMAT +23 more
Ross Seymore
Deutsche Bank
6 questions for AMD
Also covers: ADI, ALAB, AMBA +14 more
TO
Thomas O’Malley
Barclays Capital
6 questions for AMD
Also covers: ALAB, ALGM, AVGO +21 more
SR
Stacy Rasgon
Bernstein Research
5 questions for AMD
Also covers: ADI, AMAT, AVGO +7 more
JM
Joseph Moore
Morgan Stanley
4 questions for AMD
Also covers: ADI, AEVA, ALAB +22 more
CM
CJ Muse
Cantor Fitzgerald
3 questions for AMD
Also covers: ADI, AMAT, ASML +15 more
HS
Harlan Sur
JPMorgan Chase & Co.
3 questions for AMD
Also covers: ADI, ALAB, AMAT +16 more
Antoine Chkaiban
New Street Research
2 questions for AMD
Also covers: ANET, CSCO, MBLY
BR
Ben Reitzes
Melius Research LLC
2 questions for AMD
Also covers: AAPL, AMKR, ANET +9 more
JM
Joe Moore
Morgan Stanley
2 questions for AMD
Also covers: ADI, ALGM, AMBA +10 more
TH
Toshiya Hari
Goldman Sachs Group, Inc.
2 questions for AMD
Also covers: AMAT, AMKR, ARM +17 more
BR
Benjamin Reitzes
Melius Research
1 question for AMD
Also covers: AAPL, AMKR, ANET +7 more
BC
Blayne Curtis
Jefferies Financial Group
1 question for AMD
Also covers: ADI, AIP, ALAB +19 more
CM
Christopher Muse
Cantor Fitzgerald
1 question for AMD
Also covers: ADI, AMAT, ASML +13 more
CJ
C J Muse
Tanner Fitzgerald
1 question for AMD
Also covers: ASML, KLAC, MU +1 more
HK
Harsh Kumar
Piper Sandler & Co.
1 question for AMD
Also covers: ADI, AVGO, MCHP +10 more
Recent press releases and 8-K filings for AMD.
AMD joins $50M strategic investment in AI interconnect startup Eliyan
AMD
New Projects/Investments
- AMD co-led a $50 million strategic funding round for Eliyan alongside Arm, Coherent, Meta, Samsung Catalyst Fund, and Intel Capital.
- Proceeds will accelerate manufacturing and qualification of Eliyan’s next-generation interconnect IP and chiplet products, expand ecosystem partnerships, and support deployment across AI infrastructure, HPC, and edge applications.
- Eliyan’s NuLink PHY offerings include silicon-proven 64G die-to-die links and next-gen SerDes technologies (224G–448G), while its chiplet families target 1.6T to 12.8Tbps bandwidths for large-scale, disaggregated AI systems.
- The financing round underscores broad industry confidence in scalable, energy-efficient AI system architectures and interconnect solutions.
2 days ago
Riot Platforms acquires Rockdale land and signs AMD data center lease
AMD
New Projects/Investments
M&A
- Acquired 200 acres of the Rockdale Site for $96.0 million, funded by the sale of approximately 1,080 bitcoin.
- Expands Riot’s fully approved data center power portfolio to 1.7 GW across its Texas facilities.
- Signed a 10-year lease with AMD for an initial 25 MW of IT load, generating $311 million in contract revenue, with options to expand to 200 MW and $1.0 billion total value.
- Deployment to occur in two phases from January to May 2026, with $89.8 million in retrofit capex ($3.6 million/MW) and an expected $25 million annual NOI contribution.
Jan 16, 2026, 2:00 PM
AMD and TCS announce strategic AI collaboration
AMD
New Projects/Investments
- AMD and Tata Consultancy Services (TCS) have partnered to help enterprises scale AI from pilot to production, modernize hybrid cloud and edge infrastructures, and build secure, high-performance digital workplaces.
- They will co-develop industry-specific GenAI frameworks for life sciences (drug discovery), manufacturing (cognitive quality engineering), and BFSI (intelligent risk management), plus tailored accelerators to boost AI training and inference.
- TCS will integrate AMD Ryzen™, EPYC™, and Instinct™ CPUs/GPUs and AI accelerators into client and HPC solutions, and leverage AMD’s SoCs and FPGAs to drive edge innovation and industrial digitalization.
- The collaboration includes joint talent investment to rapidly upskill and certify TCS associates on AMD hardware and software technologies, building expertise for next-generation AI deployments.
Jan 14, 2026, 6:00 AM
AMD debuts GPT-Station AI Super Mobile Terminal at CES
AMD
Product Launch
- AMD and Hunan KunlunMeta unveiled the GPT-Station AI Super Mobile Terminal at CES 2026, marking their first global mobile device collaboration.
- The terminal embeds an AMD Ryzen™ AI MAX+395 chip alongside KunlunMeta’s multi-agent collaborative OS, enabling sustained professional-grade AI performance in a portable form factor.
- All data processing occurs locally—eliminating cloud dependency—and offers users a “portable team” of AI agents for tasks like market analysis, coding, and content creation.
- KunlunMeta’s underlying innovations, including the TransformerX algorithm and ScaleFusionMoS model, drive efficiency gains of up to 80% in memory usage and 78% in latency reduction, highlighting China’s shift toward full-stack AI rule-shaping.
Jan 9, 2026, 10:07 AM
AMD CEO says AI reshapes hiring
AMD
Hiring
- At CES, Lisa Su stated AI has not reduced hiring but shifted AMD’s recruiting toward AI-fluent candidates.
- The company uses AI to accelerate chip design, manufacturing, and testing workflows.
- AMD’s global workforce was about 28,000 employees as of December 2024.
- Wall Street holds a Strong Buy consensus on AMD with an average price target of $282.81, implying roughly 32.7% upside.
- Nvidia controls over 90% market share in the AI chip market, underscoring AMD’s competitive landscape.
Jan 6, 2026, 5:07 PM
AMD launches Ryzen AI Embedded processor portfolio
AMD
Product Launch
- AMD unveiled its new Ryzen AI Embedded P100 and X100 Series processors combining “Zen 5” CPU cores, an RDNA 3.5 GPU and an XDNA 2 NPU to enable low-power, low-latency AI at the edge for automotive, industrial and autonomous systems.
- The P100 Series (4–6 cores) delivers up to 50 TOPS of AI inference performance and an estimated 35% GPU rendering improvement, powering up to four 4K (or two 8K) displays at 120 fps for next-generation digital cockpits and HMIs.
- A unified, open-source software stack built on the Xen hypervisor supports CPU, GPU and NPU workloads—isolating multiple OS domains (Yocto, Ubuntu, FreeRTOS, Android/Windows) with ASIL-B capability for secure, parallel applications.
- P100 Series (4–6 cores) is sampling now with production shipments expected in Q2 2026; sampling for higher-core P100 variants and X100 Series (up to 16 cores) begins in H1 2026.
Jan 6, 2026, 3:32 AM
AMD unveils Helios AI rack and Ryzen AI 400 series at CES 2026
AMD
Product Launch
- AMD introduced Helios, a next-generation rack-scale AI platform integrating four MI455 GPUs, EPYC “Venice” CPUs, and Pensando networking per tray, delivering up to 2.9 exaflops of performance, 18,000 GPU compute units, 31 TB HBM4 memory, and ultra-low latency scale-out bandwidth per rack.
- The company launched the Ryzen AI 400 Series notebook processors featuring up to 12 Zen 5 CPU cores, 16 RDNA 3.5 GPU cores, and an XDNA 2 NPU delivering up to 60 TOPS for on-device AI workloads.
- AMD highlighted strong customer partnerships, noting 60% of Luma AI’s inference workloads run on AMD cards and previewing Liquid AI’s upcoming LFM 3 multimodal models optimized for AMD Ryzen AI platforms.
- Demonstrations included edge and physical AI use cases with Generative Bionics’ human-like robots powered by Ryzen AI Embedded and Versal AI Edge, and Blue Origin’s spaceflight computers based on Versal 2 for lunar lander navigation.
Jan 6, 2026, 2:30 AM
AMD unveils AI hardware roadmap at CES 2026
AMD
Product Launch
- AMD announced the Helios AI rack, a double-wide OCP design housing 72 MI455 GPUs (320 B transistors, 432 GB HBM4) and Venice CPUs, delivering up to 2.9 exaflops per rack.
- The MI455 GPU offers up to 10× inference performance over the prior generation and will ship later this year as part of Helios.
- AMD introduced the Ryzen AI 400 Series mobile processors (up to 12 Zen 5 CPU cores, 16 RDNA 3.5 GPU cores, and an XDNA 2 NPU delivering 60 TOPS) alongside the Ryzen AI Max platform for local AI development.
- The company outlined its MI500 series roadmap—built on CDNA 6 with 2 nm process and HBM4E—to achieve a 1,000× increase in AI performance by 2027.
Jan 6, 2026, 2:30 AM
AMD unveils AI hardware and roadmap at CES 2026 Keynote
AMD
Product Launch
- Showcased the Helios AI Rack delivering 2.9 Exaflops, 31 TB HBM4 memory and 43 TB/s scale-out bandwidth on a 2 nm/3 nm “Zen 6” CPU + MI455X GPU platform.
- Introduced the next-gen Instinct MI455X GPU with 10× performance gain over MI355X and outlined a roadmap to >1000× AI performance improvement by 2027 via the M1500 series.
- Launched the AMD Ryzen™ AI 400 series CPUs featuring 60 AI TOPS, the AMD XDNA™ 2 NPU, up to 1.7× faster content creation, available starting Q1 2026.
- Emphasized an open AI ecosystem with partnerships spanning AWS, Google, Microsoft, Oracle, IBM, Dell, Lenovo and developer support via the ROCm™ platform.
Jan 6, 2026, 2:30 AM
AMD unveils AI compute and HPC innovations at CES 2026
AMD
Product Launch
New Projects/Investments
- AMD rolled out high-performance AI data center solutions including the Helios rack powered by MI455 GPUs and Venice CPUs delivering up to 2.9 exaflops per rack.
- Announced AI PC platforms: Ryzen AI Max with 16 Zen 5 CPU cores, 40 RDNA 3.5 GPU CUs, XDNA 2 NPU (50 TOPS, up to 128 GB UMA), and the Ryzen AI Halo developer system supporting 200 billion-parameter models, shipping in Q2 2026.
- Highlighted strategic partnerships, including a 10× expansion with OpenAI for Luma multimodal workloads (60% inference on AMD cards) and collaboration with Illumina to accelerate genomics compute.
- Emphasized leadership in HPC and AI convergence by powering the world’s two fastest supercomputers and unveiling DOE Genesis program systems Lux (AI factory) and Discovery (2028 flagship) to advance scientific research.
Jan 6, 2026, 2:30 AM
Quarterly earnings call transcripts for ADVANCED MICRO DEVICES.
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