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Intel Corporation is a global integrated device manufacturer (IDM) specializing in the design, development, manufacturing, marketing, and sale of CPUs and related solutions. Their products are utilized globally by consumers, enterprises, governments, and educational organizations, and are primarily sold to OEMs, ODMs, cloud service providers, and other manufacturers through various channels . Intel's product offerings provide end-to-end solutions, scaling from data centers to networks, PCs, edge computing, and emerging fields like AI and autonomous driving . The company's primary CPU products include Intel Core processors for notebooks and desktops, Intel Xeon processors for data centers and AI, and Intel Atom processors for entry-level platforms .
- Client Computing Group (CCG) - Focuses on end-user form factors, providing Intel Core processors for notebooks and desktops.
- Data Center and AI (DCAI) - Delivers data center and AI solutions, including Intel Xeon processors.
- Network and Edge (NEX) - Offers networking and edge solutions to enhance connectivity and processing at the network's edge.
- Mobileye - Develops advanced driver-assistance systems and autonomous driving technologies.
- Intel Foundry Services (IFS) - Provides foundry services to other manufacturers, supporting their semiconductor manufacturing needs.
| Name | Position | External Roles | Short Bio | |
|---|---|---|---|---|
David Zinsner Executive | Interim Co-CEO and CFO | None | Joined Intel in January 2022 as CFO; previously held senior roles at Micron Technology and Analog Devices. Appointed Interim Co-CEO in December 2024. | View Report → |
Michelle Johnston Holthaus Executive | Interim Co-CEO and CEO of Intel Products | None | Joined Intel in 1996; held various leadership roles, including EVP of Client Computing Group and Chief Sales Officer. Appointed Interim Co-CEO in December 2024. | View Report → |
Barbara G. Novick Board | Director | BlackRock (Senior Advisor), New York Life Insurance (Board Member), Peterson Institute (Board Member) | Co-founder of BlackRock; joined Intel's Board in 2022. Expertise in investment, finance, and public policy. | |
Dion J. Weisler Board | Director | Thermo Fisher Scientific (Board Member), BHP Group (Board Member) | Joined Intel's Board in 2020; former CEO of HP Inc. with expertise in manufacturing, emerging technologies, and business development. | |
Eric Meurice Board | Director | Global Blue Group (Board Member), IPG Photonics (Board Member) | Joined Intel's Board in December 2024; former CEO of ASML Holding, where he led significant growth and strategic initiatives, including EUV lithography development. | |
Frank D. Yeary Board | Interim Executive Chair of the Board | PayPal Holdings (Board Member), Mobileye Global (Board Member), Darwin Capital Advisors (Principal) | Joined Intel's Board in 2009; became Chair in January 2023 and Interim Executive Chair in December 2024. Former Vice Chancellor at UC Berkeley and investment banker at Citigroup. | |
James J. Goetz Board | Director | Sequoia Capital (Partner), Palo Alto Networks (Board Member) | Partner at Sequoia Capital since 2004; joined Intel's Board in 2019. Focuses on cloud, mobile, and enterprise technology investments. | |
Risa Lavizzo-Mourey Board | Director | GE Healthcare Technologies (Lead Director), Merck & Co. (Board Member), Better Therapeutics (Board Member) | Joined Intel's Board in 2018; former President and CEO of the Robert Wood Johnson Foundation. Expertise in healthcare, governance, and public policy. | |
Steve Sanghi Board | Director | Microchip Technology (Chairman and Interim CEO), Impinj (Board Member) | Joined Intel's Board in December 2024; former CEO of Microchip Technology, where he achieved 121 consecutive quarters of profitability and significant market value growth. | |
Tsu-Jae King Liu Board | Director | UC Berkeley (Dean of Engineering), MaxLinear (Board Member) | Joined Intel's Board in 2016; renowned semiconductor researcher and co-inventor of FinFET technology. |
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What impact do the restructuring actions have on your R&D roadmap, long-term external Foundry opportunity, and any chipset funding, especially considering your previous projection of $15 billion in long-term value from external Foundry? Is there any impact on those growth targets due to the restructuring?
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How do you plan to execute your Foundry strategy given the CapEx cuts, particularly when considering the goal of bringing wafers back in-house to improve gross margins by 2026, while also increasing outsourcing to TSMC? Are the CapEx cuts reflecting that some of your Foundry customers are less committed?
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Given that your CPU competitor appears to be performing better in the same environment, have the core challenges facing Intel been accurately diagnosed? What is your contingency plan if cost-cutting measures alone do not address these issues?
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Are there any structural changes to your competitiveness, company structure, or long-term financial targets that necessitated the recent spending adjustments? Can you describe these structural changes and their potential impact on your financial goals?
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Regarding your customers engaged with on the 18A and 14A nodes, have you observed any changes in their commitment or project timelines? Are they still planning to ramp their programs, or have there been hesitations or delays?
Competitors mentioned in the company's latest 10K filing.
| Company | Description |
|---|---|
Competes in the advanced process technology marketplace and is a primary competitor in the semiconductor foundry space, focusing on delivering wafers and packaging technologies from fabrication plants primarily in Asia. | |
Samsung | Competes in the advanced process technology marketplace and is a primary competitor in the semiconductor foundry space, focusing on delivering wafers and packaging technologies from fabrication plants primarily in Asia. |
Competes in the semiconductor foundry space, focusing on delivering wafers and packaging technologies from fabrication plants primarily in Asia. | |
Competes in the semiconductor foundry space, focusing on delivering wafers and packaging technologies from fabrication plants primarily in Asia. | |
Semiconductor Manufacturing International Corporation (SMIC) | Competes in the semiconductor foundry space, focusing on delivering wafers and packaging technologies from fabrication plants primarily in Asia. |
Competes across the full spectrum of CPUs, GPUs, accelerators, and other products, and is a key competitor in the processor market. | |
Designs application processors based on ARM architecture and competes in the processor market. | |
Introduced PC products utilizing internally developed ARM-based semiconductor designs, replacing client CPUs and increasing competition with its M series products and ecosystem. | |
Provides GPU systems and competes in the accelerator products market, including GPUs for AI and other workloads. |
| Customer | Relationship | Segment | Details |
|---|---|---|---|
Customer A | Major OEM/ODM or Cloud Service Provider | Intel Products operating segments | 19% of net revenue in 2024 , 19% in 2023 , and 19% in 2022. |
Customer B | Major OEM/ODM or Cloud Service Provider | Intel Products operating segments | 14% of net revenue in 2024 , 11% in 2023 , and 12% in 2022. |
Customer C | Major OEM/ODM or Cloud Service Provider | Intel Products operating segments | 12% of net revenue in 2024 , 10% in 2023 , and 11% in 2022. Part of top three customers collectively having 47% of total trade receivables in 2024. |
Notable M&A activity and strategic investments in the past 3 years.
| Company | Year | Details |
|---|---|---|
Granulate Cloud Solutions Ltd. | 2022 | Intel acquired Granulate to integrate its real‑time AI-driven continuous optimization software that enhances compute workload performance (up to 30% improvement) and lowers cloud infrastructure costs, supporting Intel’s goal to grow its software and services revenue to $1 billion annually. |
Tower Semiconductor | 2022 | Intel’s acquisition of Tower Semiconductor was executed as a cash-for-stock deal at $53 per share (approx. $5.4 billion EV), aimed at advancing its IDM 2.0 strategy by expanding its foundry services with specialized analog semiconductor capabilities, with the deal expected to be immediately EPS accretive and subject to regulatory approvals and customary conditions. |
Recent press releases and 8-K filings for INTC.
- Intel signed a Transaction Agreement on April 14, 2025, to sell a 51% interest in its Altera business for an implied enterprise value of $8.75 billion, yielding approximately $4.40 billion in net cash proceeds, including a deferred payment of $1.00 billion in two installments.
- The agreement outlines key provisions such as employee equity award cancellations and replacements, a separation process involving a dedicated committee, and the formation of a limited partnership with defined board composition.
- Additionally, Intel will continue providing semiconductor wafer manufacturing services under an amended Foundry Manufacturing Customer Agreement through 2040, ensuring an ongoing supply commitment.
- Intel Corporation has entered into a definitive agreement to sell 51% of its Altera business to Silver Lake at a valuation of $8.75 billion.
- Under the agreement, Intel will retain a 49% stake in Altera, allowing it to focus on its core business while still benefiting from Altera's future success.
- Raghib Hussain has been appointed as CEO of Altera, effective May 5, 2025, marking a key leadership transition.
- The transaction is expected to close in the second half of 2025, subject to customary closing conditions.
- Transformation of product portfolio and manufacturing: Intel highlighted significant changes in its product strategy, including the launch of new processor families, renewed focus on the x86 architecture, and enhanced foundry services to support fabless customers.
- Customer-centric go-to-market and partner engagement: The company emphasized a shift to account-based marketing, targeted engagement with verticals such as government and automotive, and strengthened strategic partnerships including cloud and AI initiatives.
- Advancements in AI and data center solutions: Key updates include advancements in AI PC technology with the new vPro platform and data center enhancements using Xeon 6, positioning Intel strongly in both conventional and AI-driven markets.
- Intel Corporation completed the second closing of its transaction with SK hynix on March 27, 2025, receiving approximately $1.9 billion for its NAND memory technology and manufacturing business.
- The sale, which follows the first closing on December 29, 2021, also led to the termination of the existing NAND wafer manufacturing and sale agreement.
- Lip-Bu Tan has been appointed as Intel’s new Chief Executive Officer, effective March 18, 2025, succeeding the interim co-CEOs, with his appointment also including a return to the Board of Directors.
- The CEO appointment package includes a $1,000,000 base salary, a target performance bonus of 200% of his base salary, and significant long-term incentive equity awards, reflecting his extensive industry experience.