INTEL (INTC) Company Report

KeyBanc upgraded Intel to Overweight with a $60 price target, markedly above the $36.93 one-year average consensus among 36 analysts.
Analyst John Vinh highlighted outsized hyperscaler and data-center demand, noting both companies are largely sold out of server CPUs and could realize 10–15% price increases.
Intel’s foundry 18A process yields have surpassed 60%, improving versus Samsung’s SF2 and driving wins with Apple alongside interest in advanced packaging from hyperscalers.
Intel shares have rallied 129% over the past year, reflecting significant market momentum.

1 day ago

CNBC

Intel projects Military Embedded Systems Market to reach USD 4.8B by 2032

INTC

Market valued at USD 2.03 B in 2024 and expected to grow to USD 4.8 B by 2032 at a 12.53% CAGR.
Defense modernization and rising budgets are driving demand for high-performance embedded systems in mission-critical applications.
AI integration, real-time processing, and a shift toward network-centric warfare are key growth trends.
The market faces high R&D costs, cybersecurity vulnerabilities, and supply chain disruptions as primary constraints.
North America dominates the market, with Asia-Pacific emerging rapidly.

5 days ago

Press Release

Intel shares rally after Trump’s praise

INTC

Product Launch

New Projects/Investments

Intel’s stock jumped 6%–10% intraday, reaching multi-year highs after CEO Lip-Bu Tan’s meeting with President Trump.
Rally fueled by a product milestone: shipping Core Ultra Series 3 “Panther Lake” processors on the new 18A (sub-1 nm) process.
President Trump praised Tan on Truth Social and highlighted the U.S. government’s $8.9 billion CHIPS-era equity stake, now valued at about $19 billion.
The surge in Intel shares lifted peers like Broadcom, Micron and AMD, while the S&P 500 rose 0.5% and the Nasdaq Composite 0.6% amid mixed December jobs data (+50,000 jobs; 4.4% unemployment).
Benzinga flagged Intel’s technical momentum score of 95.49, with stock gains of 75.4% over six months and 114.7% over one year.

6 days ago

CNBC

Intel unveils Core Ultra Series 3 processors at CES 2026

INTC

Product Launch

Intel has begun production and ramp of its Core Ultra Series 3 processors on the 18A process node with RibbonFET and PowerVia, targeting up to 15% better performance per watt and 30% greater chip density versus prior nodes.
The new SoC delivers 60% higher CPU performance over Lunar Lake (Series 2) while cutting 4K video streaming power draw to one-third, and provides 180 TOPS total platform compute—enabling local inference of a 70 billion-parameter LLM in a 32K context.
Integrated Intel Arc B390 graphics offers 50% more GPU cores, twice the cache, 120 GPU TOPS, and delivers 70% higher gaming frame rates on average versus comparable AMD Radeon chips; it’s the first integrated GPU shipping with day-one AI-based multi-frame generation (3 AI frames per rendered frame).
Intel is synchronizing the launch of these processors across PCs, edge devices, and a new handheld gaming platform, with first consumer designs available to order from January 6, 2026, and is introducing the Intel AI Super Builder platform for hybrid local-cloud AI workloads.

Jan 5, 2026, 11:00 PM

Transcript

Intel launches Core Ultra Series 3 processors on 18A node

INTC

Product Launch

Intel shipped its first products on the 18A process node, over-delivering its end-of-2025 commitment and is ramping all three Core Ultra Series 3 die packages.
Core Ultra Series 3 delivers 60% higher CPU performance vs Lunar Lake, plus up to 15% better performance per watt and 30% higher chip density thanks to RibbonFET and PowerVia technologies.
The integrated Intel Arc B390 GPU features 50% more cores, 96 XMX AI accelerators (120 TOPS), and achieves 70% higher average frame rates vs AMD Radeon at similar power.
The SoC offers up to 180 platform TOPS (120 GPU, 50 NPU), supports 70 billion-parameter LLMs in a 32K context, and is available to order starting January 6, 2026.

Jan 5, 2026, 11:00 PM

Transcript

Intel launches Core Ultra Series 3 processors on 18A process

INTC

Product Launch

Intel unveiled Core Ultra Series 3 processors, the first built on its 18A process with RibbonFET and PowerVia, ramping Panther Lake production to deliver up to 15% better performance per watt and 30% higher chip density.
The SoC combines CPU, GPU, and NPU to deliver up to 180 platform TOPS (120 GPU, 50 NPU), supporting 70 billion-parameter models in a 32 K context for on-device AI workloads.
The integrated Intel Arc B390 GPU offers 50% more cores, 2× cache, and 96 XMX AI accelerators, delivers 70% higher gaming frame rates vs. AMD Radeon at similar power, and ships day-one with AI multi-frame generation.
Intel is collaborating with ecosystem partners—EA (Battlefield optimization), Adobe, Zoom, ByteDance (hybrid edge/cloud video processing), and Perplexity (hybrid AI browser)—to optimize AI and graphics workloads.
Core Ultra Series 3 is ramping now, with consumer designs available starting Jan 6, 2026, and extends to vPro for business and edge/robotics devices, marking Intel’s broadest AI PC platform launch.

Jan 5, 2026, 11:00 PM

Transcript

Intel unveils Panther Lake CPUs with 18A process milestone

INTC

Product Launch

Intel unveiled its Panther Lake Core Ultra Series 3 laptop processors at CES, marking the first high-volume use of its advanced 18A process as part of a push to reclaim manufacturing and market leadership.
The chips use a modular chiplet architecture (separate GPU and IO dies), integrate an NPU5 (up to 50 TOPS), support LPDDR5X/DDR5 memory and Thunderbolt 5, and will appear in over 200 laptop models globally.
Intel claims up to 60% better multi-threaded performance vs. the prior generation, 77% faster gaming, and up to 27 hours of battery life on next-gen laptops.
While compute dies are fabricated on Intel’s U.S.-based 18A node, IO and GPU dies will be manufactured off-node at TSMC or on Intel 3, underscoring a key foundry comeback milestone amid earlier yield challenges.

Jan 5, 2026, 10:43 PM

Morningstar

Intel’s Mobileye Surround ADAS Secures Second Top 10 Automaker

INTC

Product Launch

A U.S. automaker selected the EyeQ6H-powered Mobileye Surround ADAS as standard across mainstream and premium models, marking Mobileye’s second Top 10 customer deal.
Mobileye anticipates delivering over 19 million EyeQ6H-based Surround systems, including 9 million for the newly announced automaker, supplementing existing Volkswagen Group programs.
The integrated solution consolidates software-defined safety and driving functions on one chip and ECU, lowering costs and supporting automakers’ ECU consolidation efforts.
Demand for hands-free highway ADAS is rising amid stricter global regulations, positioning Surround ADAS as a next-gen mainstream solution.

Jan 5, 2026, 12:00 PM

Press Release

Intel completes $5 billion private placement with Nvidia; SoftBank commits $2 billion

INTC

New Projects/Investments

On Dec. 26, 2025, Intel sold 214,776,632 shares to Nvidia at $23.28 per share, raising $5.0 billion.
The deal grants Nvidia a 4% stake in Intel with no special governance rights, alongside a $2 billion commitment from SoftBank to strengthen Intel’s balance sheet.
The investment accompanies a strategic collaboration to co-develop data-center x86 CPUs integrating NVIDIA RTX GPU chiplets, though product timing is still unclear.
Intel’s market cap rebounded from lows near $82.7 billion to about $172.7 billion by closing, with a muted investor reaction.

Dec 29, 2025, 12:43 PM

Morningstar

Intel details 18A progress and supply challenges at Barclays Global Tech Conference

INTC

Product Launch

Guidance Update

Intel’s first 18A product, Panther Lake, shipped its initial SKU by year-end, with yields improving month-on-month and expected to reach industry-standard levels by end of 2026 into 2027.
Approximately 30% of Intel’s wafers are externally sourced; Panther Lake will bring 70% of its tiles back in-house, and Nova Lake will further increase internal wafer share, though some capacity is shifting to servers amid robust demand.
Intel is undershipping both PC and server markets, with server shortfalls expected to be larger; peak supply constraints are forecast for Q1 2026, easing gradually through the rest of the year.
Early engagements on the 14A node show improved customer feedback in the definitional phase, more mature PDKs, and reuse of second-generation FinFET/backside power learnings from 18A; volume adoption is targeted in H2 2026–H1 2027.
CapEx for 2025 is guided at $18 billion, with a directionally down plan for 2026 (±$1 billion), though spending may rise to support external foundry customer ramps.