Earnings summaries and quarterly performance for INTEL.
Executive leadership at INTEL.
Board of directors at INTEL.
Alyssa H. Henry
Detailed
Director
Andrea J. Goldsmith
Detailed
Director
Barbara G. Novick
Detailed
Director
Craig H. Barratt
Detailed
Director
Dion J. Weisler
Detailed
Director
Eric Meurice
Detailed
Director
Frank D. Yeary
Detailed
Chair of the Board
Gregory D. Smith
Detailed
Director
James J. Goetz
Detailed
Director
Stacy J. Smith
Detailed
Director
Steve Sanghi
Detailed
Director
Research analysts who have asked questions during INTEL earnings calls.
Aaron Rakers
Wells Fargo
7 questions for INTC
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Joseph Moore
Morgan Stanley
7 questions for INTC
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Ross Seymore
Deutsche Bank
7 questions for INTC
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Timothy Arcuri
UBS
7 questions for INTC
Also covers: ADI, ALGM, AMAT +17 more
Stacy Rasgon
Bernstein Research
6 questions for INTC
Also covers: ADI, AMAT, AMD +6 more
Christopher Muse
Cantor Fitzgerald
5 questions for INTC
Also covers: ADI, AMAT, AMD +13 more
Vivek Arya
Bank of America Corporation
5 questions for INTC
Also covers: ADI, ALGM, AMAT +23 more
Ben Reitzes
Melius Research LLC
4 questions for INTC
Also covers: AAPL, AMD, AMKR +9 more
Srinivas Pajjuri
Raymond James & Associates, Inc.
3 questions for INTC
Also covers: ALAB, AMAT, ARM +10 more
Blaine Curtis
Jefferies
2 questions for INTC
Also covers: TXN
Joshua Buchalter
TD Cowen
2 questions for INTC
Also covers: ADI, AIP, ALGM +15 more
William Stein
Truist Securities
2 questions for INTC
Also covers: ADI, APH, ARW +14 more
Benjamin Reitzes
Melius Research
1 question for INTC
Also covers: AAPL, AMD, AMKR +7 more
Christopher Caso
Wolfe Research
1 question for INTC
Also covers: ADI, ALGM, AMAT +16 more
Thomas O’Malley
Barclays Capital
1 question for INTC
Also covers: ALAB, ALGM, AMD +21 more
Vijay Rakesh
Mizuho
1 question for INTC
Also covers: ALGM, ALV, AMAT +16 more
Recent press releases and 8-K filings for INTC.
Intel details 18A progress and supply challenges at Barclays Global Tech Conference
INTC
Product Launch
Guidance Update
- Intel’s first 18A product, Panther Lake, shipped its initial SKU by year-end, with yields improving month-on-month and expected to reach industry-standard levels by end of 2026 into 2027.
- Approximately 30% of Intel’s wafers are externally sourced; Panther Lake will bring 70% of its tiles back in-house, and Nova Lake will further increase internal wafer share, though some capacity is shifting to servers amid robust demand.
- Intel is undershipping both PC and server markets, with server shortfalls expected to be larger; peak supply constraints are forecast for Q1 2026, easing gradually through the rest of the year.
- Early engagements on the 14A node show improved customer feedback in the definitional phase, more mature PDKs, and reuse of second-generation FinFET/backside power learnings from 18A; volume adoption is targeted in H2 2026–H1 2027.
- CapEx for 2025 is guided at $18 billion, with a directionally down plan for 2026 (±$1 billion), though spending may rise to support external foundry customer ramps.
2 days ago
Intel outlines progress on 18A yields, 14A roadmap and supply constraints
INTC
Product Launch
Guidance Update
- Intel shipped its first Panther Lake SKU on 18A by year-end, with yields improving month-over-month and on track to reach industry-standard levels by end-2026/into 2027, meeting its plan-of-record targets.
- About 30% of wafers are currently externally sourced; Panther Lake will see 70% of tiles brought back in-house, and Nova Lake will cover the full PC stack, though internal capacity is being shifted toward servers amid tight supply.
- PC demand has risen from an expected 270 million units to ~290 million in 2025, and server demand—driven by AI, power-efficiency refreshes and agentic AI workloads—has surged, creating peak supply constraints in Q1 2026, then easing through H2 2026.
- Engagement on the 14A node includes early external customer feedback in the definitional phase, more mature PDKs and second-generation FinFET/backside power learnings; yields and performance are ahead of 18A’s comparable stage, with customer ramp expected in H2 2026 into H1 2027.
- 2025 gross CapEx is $18 billion; 2026 spending is expected to be directionally down but flexible within ±$1 billion, with initial 14A capacity in Arizona and larger-scale build-out in Ohio only upon external foundry wins.
2 days ago
Intel outlines 18A progress, supply constraints, and roadmap updates
INTC
Guidance Update
Product Launch
New Projects/Investments
- Intel reports 18A yields on Panther Lake improving month-over-month, aiming for industry-standard levels by end-2026 into 2027, with the first Panther Lake SKU shipped by year-end.
- Approximately 30% of wafers are currently externally sourced; Intel plans ~70% in-house logic tiles for Panther Lake and more with Nova Lake, while shifting internal capacity to servers amid tight supply.
- PC unit demand remains robust (industry forecast raised from 270 million to ~290 million units), but Intel expects to undership server demand more than PCs in 2026 due to AI-driven refreshes, with peak supply constraints in Q1 2026.
- Intel is ahead on 14A versus 18A at a comparable development stage—engaging external customers early and improving PDKs—and anticipates external customer ramps in H2 2026 into H1 2027.
- For 2026, Intel’s CapEx is expected to be directionally down from $18 billion in 2025, with flexibility of ±$1 billion and potential increases to support external foundry wins.
2 days ago
Intel partners Cornelis and Supermicro to tackle AI and HPC infrastructure bottlenecks
INTC
Product Launch
New Projects/Investments
- Cornelis CN5000 networking integrated with Supermicro FlexTwin liquid-cooled servers to overcome power, cooling, and network constraints in AI/HPC environments.
- CN5000’s 400 Gbps platform ensures congestion-free data transfer, while FlexTwin captures up to 95% of system heat for stable performance in power-limited data centers.
- Joint testing reports up to 1.5× higher application performance, 29% better performance per networking dollar, and up to 2.3× higher performance per watt in liquid-cooled setups.
- The validated solution is available now through Supermicro and authorized Cornelis partners.
3 days ago
Intel inks pact with Tata Electronics to explore chip manufacturing
INTC
New Projects/Investments
- Intel and Tata Electronics will jointly explore manufacturing, packaging, assembly and advanced packaging of Intel’s AI-powered laptop chips and systems at Tata’s upcoming Gujarat and Assam facilities.
- Tata Electronics is committing about $14 billion to establish India’s first pure-play foundry and complementary assembly and testing units, with its Assam OSAT facility slated to begin operations in Q2 2026 and Gujarat production targeted for 2027.
- The partnership will leverage Intel’s AI compute reference designs and Tata Electronics’ EMS capabilities to rapidly scale tailored AI PC solutions, aiming to capitalize on India’s projection as a top-five AI PC market by 2030.
- Tata Electronics, employing over 65,000 people and reporting revenue of Rs 66,601 crore in the prior financial year, brings significant manufacturing scale and leadership under MD Randhir Thakur, a former Intel foundry services president.
5 days ago
Intel retains Networking and Edge Group
INTC
Management Change
- Intel is retaining its Networking and Edge Group (NEX), shelving plans to spin it off or seek outside investment to enhance integration across AI, data center, and edge computing markets.
- The move aligns with CEO Lip-Bu Tan’s strategic review, which also includes workforce reductions and a more conservative approach to foundry operations.
- NEX leader Sachin Katti, promoted to chief technology and AI officer in April 2024, departed in November to join OpenAI.
- In 2024, Intel reorganized NEX by moving its edge computing business into the Client Computing Group and shifting integrated photonics to the Data Center Group.
- Intel’s trailing twelve-months revenue of $53.44 billion, three-year revenue growth of -13.7%, and operating margin of -0.2% highlight ongoing challenges in profitability and growth.
Dec 3, 2025, 10:52 PM
Intel discusses supply constraints and 18A roadmap at UBS conference
INTC
- Intel faces wafer supply shortages across Intel 7 and 10 nodes, peaking in Q1 2026, affecting both PC and server segments with demand exceeding capacity.
- Intel 18A node progress: first Panther Lake SKU released by year-end; yields improving predictably month-over-month though still below targets; 18AP PDK matured and 18APT designated for advanced packaging, with peak wafer starts expected around 2030.
- Outsourcing strategy: ~30% outsourcing in 2025 as Arrow Lake and Lunar Lake are fully external; Panther Lake will have 70% internal logic volume and Nova Lake will further repatriate desktop wafers; Lunar Lake volumes to grow through Q4 to supplement in-house supply.
- Advanced packaging ramp: EMIB and EMIB-T engagements progressing with anticipated revenue inflection in H2 2026, offering capabilities beyond current CoWoS capacity constraints.
- Leadership and organizational changes: CEO Lip-Bu Yeh has flattened Intel from ~11 to 5–6 management layers, integrated engineering into the executive team, mandated engineer-customer interactions, and initiated legal separation of the Intel Foundry business to enhance strategic optionality.
Dec 3, 2025, 9:15 PM
Intel outlines supply constraints and technology roadmap at UBS 2025 conference
INTC
Product Launch
New Projects/Investments
Guidance Update
- Intel is undersupplying both PC and data center demand, with shortages most pronounced on Intel 7. Multiple cloud service providers are seeking long-term supply agreements, and the peak of shortages is expected in Q1 2026.
- The first Panther Lake (Intel 18A) SKU shipped by year-end 2025; yields are improving predictably month-over-month, with additional SKUs ramping in H1 2026, though still below target levels.
- Intel’s outsourcing ratio is ~30% in 2025, driven by fully outsourced Arrow Lake and Lunar Lake; 70% of Panther Lake logic tiles will be produced internally, with further insourcing via Nova Lake desktop parts in 2027.
- Momentum in advanced packaging (EMIB, EMIB-T) is building as customers seek alternatives to CoWoS tightness, with revenues expected to ramp in H2 2026.
- Capital expenditures of ~$18 billion in 2025 are guided with a downward bias; 2026 CapEx will balance fab efficiency improvements against the need to alleviate current supply constraints.
Dec 3, 2025, 9:15 PM
Intel outlines supply challenges and technology roadmap at UBS Global Tech & AI Conference
INTC
Guidance Update
New Projects/Investments
- Intel is experiencing peak supply shortages in Q1 due to tightness at Intel 7 and 10, undershipping demand in both PC and data center, with multiple hyperscalers seeking long-term agreements.
- The Intel 18A node (Panther Lake) shipped its first SKU by year-end; yields are improving predictably each month, with additional SKUs ramping in H1 2026 and long-term wafer starts peaking near 2030.
- The outsourcing ratio is about 30% in 2025, driven by fully outsourced Arrow Lake and Lunar Lake; Panther Lake will be 70% internally produced, and Lunar Lake volumes are set to grow into 2026 despite memory-related gross margin headwinds.
- Advanced packaging (EMIB/EMIB-T) engagements are maturing, with back-end revenue inflecting in H2 2026, and Intel is expanding its ASIC business for networking and AI accelerators under new leadership.
Dec 3, 2025, 9:15 PM
Intel invests RM860M in Malaysia assembly and testing hub
INTC
New Projects/Investments
- Intel will invest RM860 million to enhance its assembly and testing operations in Malaysia, reinforcing the country as a key global semiconductor hub.
- The funding supports the nearly completed RM12 billion Advanced Packaging Facility in Penang, one of Intel’s most advanced plants globally.
- Intel had earlier committed RM30 billion over 10 years (announced in 2023) to expand operations in Penang and Kulim, Kedah.
- The company will allocate RM2.8 million over two years to collaborate with Malaysian educational institutions on research, elective programs, and skills development.
Dec 1, 2025, 11:22 AM
Quarterly earnings call transcripts for INTEL.
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