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Qorvo, Inc. is a global leader in developing and commercializing technologies and products for wireless, wired, and power markets . The company operates through three main segments, providing solutions for various industries, including automotive, defense, aerospace, and consumer electronics . Qorvo's offerings include RF, analog mixed signal, power management, connectivity, and sensor solutions, catering to major smartphone manufacturers and other markets .
- Advanced Cellular Group (ACG) - Supplies advanced cellular RF solutions for smartphones and consumer devices, leveraging technology to deliver high-performance cellular products .
- High Performance Analog (HPA) - Provides RF, analog mixed signal, and power management solutions, serving markets such as automotive, defense and aerospace, and cellular infrastructure .
- Connectivity and Sensors Group (CSG) - Focuses on connectivity and sensor solutions, including ultra-wideband, Bluetooth Low Energy, and Wi-Fi, targeting markets like home electronics, industrial automation, and automotive .
| Name | Position | External Roles | Short Bio | Start Date | |
|---|---|---|---|---|---|
Gina B. Harrison Executive | Vice President and Corporate Controller | None | CPA with over 30 years of experience in corporate and public accounting, joined Qorvo in 2015. | Nov 2015 | |
Grant A. Brown Executive | Senior Vice President and Chief Financial Officer | None | Joined Qorvo in 2015, previously held roles in financial planning and treasury. | Aug 2022 | |
Paul J. Fego Executive | Senior Vice President and President of Global Operations | None | Extensive experience in semiconductor manufacturing, previously at Texas Instruments and Photronics, Inc. | Jul 2022 | |
Philip J. Chesley Executive | Senior Vice President and President of High Performance Analog | None | Joined Qorvo in 2021, previously held leadership roles at Renesas Electronics and Intersil Corporation. | Jul 2022 | |
Robert A. Bruggeworth Executive | President and Chief Executive Officer | Board Member at MSA Safety Incorporated and Seagate Technology Holdings plc | Over 30 years of experience in semiconductors and electronic products. Former CEO of RF Micro Devices. | Dec 2013 | View Report > |
Steven E. Creviston Executive | Senior Vice President and President of Connectivity & Sensors | Director at LightPath Technologies, Inc. | Long-standing career at Qorvo and RF Micro Devices, focusing on mobile products and connectivity. | Jul 2022 | |
Dr. Walden C. Rhines Board | Chair of the Board and Lead Independent Director | President and CEO of Cornami, Inc., CEO of Rhines Consultants, Board Member at Silvaco Group Inc. and Pallidus | Over 50 years in the semiconductor industry, former CEO of Mentor Graphics, extensive board experience. | Jan 2015 | |
John R. Harding Board | Director | Chair of the Board of Meta Materials Inc., Director at SandFirst, Inc. | Co-founder of eSilicon Corporation, extensive experience in semiconductor design and manufacturing. | Jan 2015 | |
Judy Bruner Board | Director | Director at Applied Materials, Inc., Rapid7, Inc., and Seagate Technology Holdings plc | Extensive financial management experience, former CFO at SanDisk Corp. | May 2021 | |
Roderick D. Nelson Board | Director | Founder and Principal of Nelson Technology Partners, Inc., Co-founder of Tritech Sales and Services, LLC | Substantial experience in wireless communications, expertise in 4G and 5G network deployment. | Jan 2015 | |
Susan L. Spradley Board | Director | Partner at TAP Growth Group, Board Member at Catalyst Campus | Over 25 years in wireless telecommunications, extensive public company executive leadership experience. | Jan 2017 |
- Given the intense competition in the RF components market within the Android ecosystem, how do you plan to sustain and grow your market share, and what differentiates your solutions from those of your competitors?
- You mentioned expectations of gaining share at your largest customer; can you elaborate on the specific areas or products where you see this opportunity, and what risks could impede achieving this growth?
- With the transition to 8-inch BAW wafers, what challenges do you anticipate in scaling production, and how might this impact your margins and capital expenditures in the near term?
- As you expand into new markets like solid-state circuit breakers for EVs, how does this diversification align with your core competencies, and what competitive advantages do you have to succeed against established players?
- Considering the potential for AI integration in smartphones, how are you positioning your products to capitalize on this trend, and what investments are you making to ensure you remain competitive if AI-driven features accelerate demand?
Competitors mentioned in the company's latest 10K filing.
| Company | Description |
|---|---|
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Infineon Technologies AG | Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. |
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Competes in both the High Performance Analog (HPA) and Connectivity and Sensors Group (CSG) segments, focusing on RF, analog mixed signal, power management, and connectivity solutions. | |
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Sumitomo Electric Device Innovations | Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. |
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Competes primarily in the High Performance Analog (HPA) segment, which focuses on RF, analog mixed signal, and power management solutions. | |
Competes in both the Connectivity and Sensors Group (CSG) and Advanced Cellular Group (ACG) segments, focusing on connectivity, sensor, and cellular RF solutions. | |
Nordic Semiconductor | Competes primarily in the Connectivity and Sensors Group (CSG) segment, which focuses on connectivity and sensor solutions. |
Qualcomm Technologies, Inc. | Competes in both the Connectivity and Sensors Group (CSG) and Advanced Cellular Group (ACG) segments, focusing on connectivity, sensor, and cellular RF solutions. |
Competes primarily in the Connectivity and Sensors Group (CSG) segment, which focuses on connectivity and sensor solutions. | |
Competes in both the Connectivity and Sensors Group (CSG) and Advanced Cellular Group (ACG) segments, focusing on connectivity, sensor, and cellular RF solutions. | |
Competes primarily in the Advanced Cellular Group (ACG) segment, which focuses on cellular RF solutions. |
| Customer | Relationship | Segment | Details |
|---|---|---|---|
Apple Inc. | Qorvo provides radio frequency (RF) solutions for mobile devices through multiple contract manufacturers. | ACG | 46% of total revenue in FY2024 , 37% in FY2023 , 33% in FY2022. Part of top three accounts receivable that collectively comprised 60% of aggregate A/R as of March 30, 2024. |
Samsung Electronics Co., Ltd. | Qorvo provides radio frequency (RF) solutions for mobile devices. | ACG | 12% of total revenue in FY2024 , 12% in FY2023 , 12% in FY2022. Part of top three accounts receivable that collectively comprised 60% of aggregate A/R as of March 30, 2024. |
Notable M&A activity and strategic investments in the past 3 years.
| Company | Year | Details |
|---|---|---|
Anokiwave, Inc. | 2024 | Acquired for a total purchase price of $93.7 million (with $10.7 million in cash acquired), the deal strategically expanded Qorvo’s RF front-end capabilities by incorporating high-performance ICs for beamforming and IF-to-RF conversion, complementing its offerings in defense, aerospace, SATCOM, and 5G markets; the team was integrated into Qorvo’s High Performance Analog segment. |
United Silicon Carbide, Inc. | 2021 | Completed for approximately $227.1 million in cash plus up to $31.3 million in contingent consideration, this acquisition strengthened Qorvo's portfolio by adding silicon carbide power semiconductors ideal for EVs, industrial power, and data centers, expanding its market reach and enabling access to a total addressable market nearing $10 billion. |
NextInput, Inc. | 2021 | Acquired for about $173.4 million in cash, the transaction enhanced Qorvo’s portfolio with advanced MEMS-based sensing solutions for mobile and other applications; it included significant allocations to intangible assets and goodwill to capture synergies and augment comprehensive sensing capabilities. |
Recent developments and announcements about QRVO.
Earnings
New Earnings (Q3 2025)
·Jan 28, 2025, 11:47 PMView full earnings summary →Qorvo sees 10–12% growth in HPA/CSG for FY26—defense/aerospace and UWB are key drivers—offset by a $150–200M annual drop in Android 5G. ACG likely dips single digits, but largest-customer revenue remains “flat to up.” Margins could push toward 50% next year.